Polyamide-imide (PAI)

  • Grades
  • Features

PAI has excellent stability and strength when operating in temperatures exceeding 500°F, and is ideal for applications requiring close tolerance parts. Typical components produced from TECAPAI CM grades include computer wafer handling units, bearings, bushings, wear pads, seals, compressors, and pump parts. Since post-curing is not required after machining, costs associated with that process can be eliminated.

TECAPAI Polyamide-imide (PAI) is a high-performance engineering thermoplastic. This is a family of products that combines the exceptional performance of thermoset polyimides with the melt-processing advantage of thermoplastics. PAI exhibits greater compressive strength and higher impact resistance than most advanced engineering plastics. High creep resistance and an extremely low coefficient of linear thermal expansion (CLTE) provide excellent dimensional stability. Wear-resistance grades of TECAPAI offer great performance in both dry and lubricated environments. High-strength grades retain their toughness, high strength and high stiffness up to 275°C (525°F).

  • High temperature performance
    • Continuous service temperature up to 500°F (260°C).
  • Good chemical resistance
    • Broad chemical resistance includes strong acids and most organics.
  • Excellent wear resistance
    • When blended with internal lubricants, offers excellent tribological properties.
  • Electrical properties remain stable over a wide range of temperatures and frequencies

Typical Applications

  • Thermal & Electrical Insulators
  • Bearings and Bushings
  • Wear Rings
  • Test Sockets
  • Electrical Components
  • Back-up and V-Rings
  • Piston Rings and Rider Bands